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HMC1051/HMC1052/HMC1053
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PACKAGE DRAWING HMC1052L (16-PIN LCC)
PACKAGE DRAWING HMC1053 (16-PIN LCC)
STENCIL DESIGN AND SOLDER PASTE
A 4 mil stencil and 100% paste coverage is recommended for the electrical contact pads.
REFLOW AND REWORK
The HMC1051ZL and HMC1053 parts should reference application note AN-216 and it should be noted that these parts
are moisture sensitive (MSL 3) and have maximum reflow temperature of 220癈. The other part types have no special
profile required (handle the HMC1052L and HMC1051Z as MSL 1) and are compatible with lead eutectic or lead-free
solder paste reflow profiles. Honeywell recommends the adherence to solder paste manufacturers guidelines. The
Symbol
Millimeters
min
max
A
0.80
1.00
A1
0
0.05
A
.2 REF
b
0.18
.
D
. B
D2
1.55
1.
E
. B
E2
1.55
1.
. B
L
0.30
.
N
1
ND
4
NE
4
r
B min /2
.1
.1
.1
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